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DOT Code: 500.684-030

Industry: electron. comp.

Electroplates semiconductor wafers and electronic components, such as copper leads and rectifiers, with metals, such as gold, silver, and lead: Reads processing sheet to determine plating time and specifications. Places components or wafers in basket or fixture, using tweezers, and immerses components or wafers in chemical solution baths for specified time to clean and plate components or wafers. May measure thickness of photoresist and metal on wafer surface, using micrometer, and test electrical circuitry of individual die on wafer, using test probe equipment. May measure anode width on wafer surface, using microscope measuring equipment.

GOE: 06.04.19 STRENGTH: L GED: R3 M2 L2 SVP: 3 DLU: 86